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2009-10-12 06:58:44, Hit : 2,998, Vote : 87 |
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»ï¼ºÀüÀÚ DMC (Digital Media & Communication)ºÎ¹® ¿µ»óµð½ºÇ÷¹ÀÌ»ç¾÷ºÎ ä¿ë´ã´çÀÚ ÀÓ¹ü¼ö ´ë¸®ÀÔ´Ï´Ù.
»ï¼ºÀüÀÚÀÇ ¹Ì·¡ ÇÙ½É BusineesÀÎ ¿µ»óµð½ºÇ÷¹ÀÌ»ç¾÷ºÎ¿¡¼ ¿ì¼öÇÑ ÀÎÀ縦 ¸ðÁýÇϰí ÀÖ½À´Ï´Ù.
¿µ»óµð½ºÇ÷¹ÀÌ»ç¾÷ºÎ´Â LED TV, LCD TV, BD-P, HTS ±×¸®°í Monitor ºÐ¾ß¿¡¼ ÇöÀç ¼¼°è1À§¸¦ ´Þ¼ºÇϰí ÀÖ½À´Ï´Ù.
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¿µ»óµð½ºÇ÷¹ÀÌ»ç¾÷ºÎ¿¡¼ ±Û·Î¹ú ¿ì¼ö ÇÙ½ÉÀηÂÀ¸·Î ¼ºÀåÇÏ½Ã°í ½ÍÀº ¿©·¯ºÐÀÇ ¸¹Àº °ü½É ºÎʵ右´Ï´Ù.
¡á ¸ðÁý ´ë»ó
¤ý¹Ú»ç ÇÐÀ§ ¼ÒÁöÀÚ (±âÁ¹¾÷ÀÚ)
¤ý2010³â ¹Ú»ç ÇÐÀ§ Á¹¾÷ ¿¹Á¤ÀÚ
¡á ¸ðÁý ºÐ¾ß
¡à HCI
¢¹ POSITION : HCI Engineer
REQUIREMENTS : Advanced degree in Human Computer Interaction.
Ability to demonstrate rapid prototyping with various programming tool
3+ years experience in software product development with crossplatform is preferred.
(Java, C++, XUL, Flex, Silverlight, MFC, ActionScript 2.0,
XML/XSLT, HTML/XHTML/WAP, CSS & DHTML, Java, JavaScript,
PHP/SQL).
User Interface design knowledge is preferred.
Experience designing interfaces for consumer products. Experience related to Motion sensing is strongly preferred.
¡à S/W
¢¹ POSITION : Embedded System Software engineer
FIELDS : - Middle-ware/Application
- Embedded Linux Driver
- Linux Kernel Driver/Application
- Windows Application programming
- DTV Chip level Driver
REQUIREMENTS : Excelent in C++, (C, Java optional), 2+ years experience
¢¹ POSITION : OOP based GUI module design (Embedded) engineer
REQUIREMENTS : Excelent in C++, (C, Java optional), 2+ years experience
¡à SoC
¢¹ POSITION : Chip Device Driver engineer
REQUIREMENTS : 4+ years experience of developing Device Drivers for SoC
¢¹ POSITION : Analog Circuit design engineer
FIELDS : - Analog front-end circuit design (ADC, DAC)
- High-Speed Serial Interface design
REQUIREMENTS : 3+ years' Experience of designing SoC Level High Speed ADC,
Analog Front-end, Analog Interface, High-speed Serial Interface, etc.
¢¹ POSITION : SoC design for Embedded DSP/CPU/GPU engineer
REQUIREMENTS : 2+ years' Experience of SoC design,
Experience of coding MPEGx codec, Real-time Video processing
or Experience of designing BUS architecture, interface between fast CPUs/DSPs and BUS
or Experience of designing interface to the 3D graphics engine
¡à Mechanical Engineering
¢¹ POSITION : Mechatronics Research engineer
FIELDS : Structural/Thermal/Noise Analysis & Design
Polymer Engineering
Molding Engineering
REQUIREMENTS : 2+ years' Experience in the related area
mold engineering knowledge
¡à Marketing
¢¹ POSITION : MARKETING
FIELDS : Product planning, Overseas business, Online Marketing, Market-sensing, Public relations
REQUIREMENTS : Very fluent in English, MBA, 2+ years experience of marketing
¡á Áö¿ø ¹æ¹ý
À§ÀÇ ¾÷¹«¿¡ °ü½ÉÀÌ ÀÖÀ¸½Å ºÐÀº ¾Æ·¡ ¾ç½ÄÀ¸·Î ÀÛ¼ºÇÏ¿© ä¿ë ´ã´çÀÚ¿¡°Ô Á¦Ãâ(e-mail) ºÎʵ右´Ï´Ù.
Ex.) TITLE : [Apply for Experienced]Jackie Chen (Peking Univ.)
Cover letter:
Applicant : Jackie Chen
Final Graduate School : Peking Univ.
Major : Electric Engineering
Degree : PhD
Expected Graduate Date : 2010.08
Phone number : 555-555-5555
Email address : Jackie@pku.edu.cn
Technical interests : R&D Job in Image processing,
Possible time slots of Phone Interview(CCI)
: 1:00~3:00PM(GMT+8) on Week-days
Attached: Resume
(¼¼ºÎÀü°ø ¹× °ü½ÉºÐ¾ß¸¦ »ó¼¼È÷ ÀÛ¼º ºÎʵ右´Ï´Ù.)
Due date: 2009.10.31
ä¿ë´ã´çÀÚ:
Bumsoo Lim <bumsoo.lim@samsung.com>, +82-31-277-1746
Dongwook Han <dw911.han@samsung.com>, +82-31-277-1585
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